𝔖 Bobbio Scriptorium

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High-density interconnects for electronic packaging: C W EICHELBERGER, R J WOJNAROWSKI, R O CARLSON, L M LEVINSON (GE Corporate Res. & Dev., Schenectady, NY, USA) Proc. SPIE — Int. Soc. Opt. Eng. (USA), vol. 877, pp. 90–91 (1988). (Micro-Optoelectronic Materials, Los Angeles, CA, USA, 13–14 Jan. 1988)

Publisher: Elsevier Science
Year: 1989
Tongue: English
Weight: 99 KB
Volume: 20
Category: Article
ISSN: 0026-2692
DOI: 10.1016/0026-2692(89)90023-2

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