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Laser camera used for reactor inspection


Publisher
Elsevier Science
Year
1986
Weight
151 KB
Volume
19
Category
Article
ISSN
0308-9126

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High-speed solder bump inspection system
โœ Hiroyuki Tsukahara; Yoji Nishiyama; Fumiyuki Takahashi; Takashi Fuse; Toru Nishi ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› John Wiley and Sons ๐ŸŒ English โš– 538 KB

We have developed technologies which inspect the shape of solder bumps. The bumps are used to solder an LSI to a printed wiring board in high-speed workstations. The inspection system developed can measure the height, diameter, and brightness of bumps at very high speed. The bump height is measured