Microablation with ultrashort laser puls
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Jianxin Zhao; Bernd Huettner; Arnd Menschig
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Article
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2001
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Elsevier Science
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English
β 248 KB
This paper reports the micromachining results of di erent materials (Al, Si, InP and fused silica) using a Ti : sapphire laser at the wavelength of 800 and 267 nm with variable pulse lengths in the range from 100 fs to 10 ps. The hole arrays with a diameter up to a few m through microdrilling are pr