Microablation with ultrashort laser pulses

✍ Scribed by Jianxin Zhao; Bernd Huettner; Arnd Menschig

• Publisher: Elsevier Science
• Year: 2001
• Tongue: English
• Weight: 248 KB
• Volume: 33
• Category: Article
• ISSN: 0030-3992
• DOI: 10.1016/s0030-3992(01)00066-4

✦ Synopsis

This paper reports the micromachining results of di erent materials (Al, Si, InP and fused silica) using a Ti : sapphire laser at the wavelength of 800 and 267 nm with variable pulse lengths in the range from 100 fs to 10 ps. The hole arrays with a diameter up to a few m through microdrilling are presented. We discussed how an e ective suppression of the thermal di usion inside the ablated materials and an e ective microablation could be realized. If the laser uence is taken only slightly above the threshold, a hole array can be drilled with diameters even smaller than the wavelength of the laser. Some examples are presented in the paper.