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Large GMI effect in Co-rich amorphous wire by tensile stress

✍ Scribed by S.L. Zhang; J.F. Sun; D.W. Xing; F.X. Qin; H.X. Peng


Book ID
113725015
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
452 KB
Volume
323
Category
Article
ISSN
0304-8853

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## Abstract In order to study the effect of wire bonding by Cu electroplating on giant magneto‐impedance (GMI) stability of microwires for potential sensor application. The electroplated microstructure was observed by scanning electron microscopy (SEM) and GMI was studied by a precision impedance a