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Key reliability issues for copper integration in damascene architecture

โœ Scribed by R Gonella


Book ID
104305547
Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
198 KB
Volume
55
Category
Article
ISSN
0167-9317

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Overview of Cu contamination during inte
โœ J Torres; J Palleau; F Tardif; H Bernard; A Beverina; P Motte; R Pantel; M Juhel ๐Ÿ“‚ Article ๐Ÿ“… 2000 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 510 KB

A detailed study of copper contaminating steps performed during integration of multilevel Cu metallisation in dual damascene architecture has been performed. Contamination at the wafer back and the bevel edge should make it difficult to use the same equipment for conventional technology and new copp