Joint Ventures
AMD/Sony Agreed to cooperate in a broad joint devcelopment programme, they will jointly develop, produce and market a family of VLSI chips using a common set of specifications. Both companies will have access to each other's chip designs and masks and the right to market these products.
ES2/Philips/Texas Instruments
Agreement which extends prototyping services for the System Cell range of CMOS standard cell ASICs. In addition to high volume manufacturing and standard prototyping Texas Instruments and Philips will also offer accelerated prototyping in cooperation with ES2. Under the terms of the agreement ES2, using E-beam direct wire techniques, will supply European customers with fast, lower cost prototypes and low-volume quantities in a System Cell-compatible process.
Fairchild/Honeywell A bipolar gate array second source deal in which the two will trade a series of circuits starting with a new 8,000 gate family introduced by Honeywell.
Fujitsu/Hitachi
Jointly develop and manufacture a new 32 bit microprocessor family.
Harris Semiconductor/Analogic
Agreement coveting the second sourcing of Harris products by Analogic, plus the joint development of new hybrid products.
Hyundai Electronics Co/General Instrument
Five year agreement calling for the transfer of EPROM and EEPROM CMOS process and production data to Hyundai.
Intel/IBM
Technology exchange agreement, gives IBM the tights to incorporate Intel's microprocessor and peripheral chip design into customised chips.
Laserpath/GE(USA)
Joint marketing and development agreement for the manufacture and sale of Laserpath's family of Quick-Chip prototype laser-programmable gate arrays.
Lattice Semiconductor/SGS
Technology cooperation agreement which includes a manufacturing and non-exclusive second source licensing agreement for Lattice generic array logic products. LSI Logic/Kawasaki Steel Corp. Joint venture for the production of gate arrays.