Diffusion bonding of a Cu–Cr–Zr alloy to
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I.S. Batra; G.B. Kale; T.K. Saha; A.K. Ray; J. Derose; J. Krishnan
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Article
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2004
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Elsevier Science
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English
⚖ 180 KB
In the present work, diffusion bonding of Cu-1 wt.% Cr-0.1 wt.% Zr alloy to tungsten as well as to stainless steel 316 (SS) has been attempted using nickel as an interlayer. This could be achieved in a single step and the bonds were found to be metallurgically sound with the strength exceeding that