Diffusion bonding of a Cu–Cr–Zr alloy to stainless steel and tungsten using nickel as an interlayer

✍ Scribed by I.S. Batra; G.B. Kale; T.K. Saha; A.K. Ray; J. Derose; J. Krishnan

• Publisher: Elsevier Science
• Year: 2004
• Tongue: English
• Weight: 180 KB
• Volume: 369
• Category: Article
• ISSN: 0921-5093
• DOI: 10.1016/j.msea.2003.10.296

✦ Synopsis

In the present work, diffusion bonding of Cu-1 wt.% Cr-0.1 wt.% Zr alloy to tungsten as well as to stainless steel 316 (SS) has been attempted using nickel as an interlayer. This could be achieved in a single step and the bonds were found to be metallurgically sound with the strength exceeding that of the sintered tungsten used in this work.