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Ir Diffusion Barriers in Ni/Au Ohmic Contacts top-Type CuCrO2

โœ Scribed by W.T. Lim; P.W. Sadik; D.P. Norton; B.P. Gila; S.J. Pearton; I.I. Kravchenko; F. Ren


Book ID
107455068
Publisher
Springer US
Year
2007
Tongue
English
Weight
508 KB
Volume
37
Category
Article
ISSN
0361-5235

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RF-sputtered CrB2 diffusion barrier for
โœ W.T. Lim; P.W. Sadik; D.P. Norton; B.P. Gila; S.J. Pearton; I.I. Kravchenko; F. ๐Ÿ“‚ Article ๐Ÿ“… 2008 ๐Ÿ› Elsevier Science ๐ŸŒ English โš– 685 KB

Ohmic contacts to p-type CuCrO 2 using Ni/Au/CrB 2 /Ti/Au contact metallurgy are reported. The samples were annealed in the 200-700 8C range for 60 s in flowing oxygen ambient. A minimum specific contact resistance of $2 ร‚ 10 ร€5 V cm 2 was obtained after annealing at 400 8C. Further increase in the