In this work we have studied the influence of thermal annealing on the structural and electrical properties of W-Ti thin films, deposited on n-type (100) silicon wafers. The films were deposited by d.c. sputtering from a 90:10 wt.% W-Ti target, using Ar ions, to a thickness of ~170 nm. After deposit
Investigations of thermal annealing effects on electrical and structural properties of SrTaO based MIM capacitor
✍ Scribed by C. Baristiran Kaynak; M. Lukosius; I. Costina; B. Tillack; Ch. Wenger; G. Ruhl; S. Rushworth
- Publisher
- Elsevier Science
- Year
- 2010
- Tongue
- English
- Weight
- 395 KB
- Volume
- 87
- Category
- Article
- ISSN
- 0167-9317
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✦ Synopsis
The annealing effects on dielectric and electrode materials in Ti/SrTaO/TaN/TiN/Ti/Si metal-insulatormetal (MIM) capacitors were studied. The electrical and structural properties were investigated after subjecting the samples to annealing temperatures of 500 °C, 700 °C and 900 °C. The electrical results revealed that the dielectric constant (k value) of Sr-Ta-O increased from 18 to 50 with increasing annealing temperature. This improvement in k value can be associated to the crystallization of dielectric layer. However, the leakage current density increased several orders of magnitudes with increase of the annealing temperatures. This observation was attributed to crystallization of dielectric, degradation of TaN electrode and out-diffusion of Si from the substrate.
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## Abstract Two series of aromatic polyimides containing various‐sized alkyl side groups were synthesized by thermal imidization of the poly(amic acid)s prepared from the polyaddition of benzophenonetetracarboxylic dianhydride and hexafluoro‐isopropylidene bis(phthalic anhydride) with 4,4′‐methylen