✦ LIBER ✦

Investigating the integrity and reliability of electronic packaging and interconnection materials

✍ Scribed by Bela Sandor; Tom Kilinski

Book ID: 113008276
Publisher: The Minerals, Metals & Materials Society
Year: 1990
Tongue: English
Weight: 300 KB
Volume: 42
Category: Article
ISSN: 1047-4838
DOI: 10.1007/bf03221083

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Materials for high-density electronic pa

Materials for high-density electronic packaging and interconnection

📂 Article 📅 1991 🏛 Elsevier Science ⚖ 470 KB

Micro- and Opto-Electronic Materials and

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging || Lead-Free Solder Materials: Design For Reliability

✍ Suhir, E.; Lee, Y. C.; Wong, C. P. 📂 Article 📅 2007 🏛 Springer US ⚖ 609 KB

Lead-Free Solders: Materials Reliability

Lead-Free Solders: Materials Reliability for Electronics (Subramanian/Lead-Free Solders: Materials Reliability for Electronics) || Reliability of Lead-Free Electronic Solder Interconnects: Roles of Material and Service Parameters

✍ Subramanian, K. N. 📂 Article 📅 2012 🏛 John Wiley & Sons, Ltd 🌐 English ⚖ 91 KB

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to al

Packaging and interconnecting integrated

Packaging and interconnecting integrated networks : E. G. Shower, Electron. Ind.21, 100–103

📂 Article 📅 1963 🏛 Elsevier Science 🌐 English ⚖ 94 KB

Materials processing and reliability of

Materials processing and reliability of 3D interconnects

📂 Article 📅 2011 🏛 IEEE 🌐 English ⚖ 166 KB

The Chemical Modeling of Electronic Mate

The Chemical Modeling of Electronic Materials and Interconnections

✍ J. K. Kivilahti 📂 Article 📅 2002 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 788 KB