✦ LIBER ✦

Intermetallic Compounds Formed in Sn-20In-2.8Ag Solder BGA Packages with Ag/Cu Pads

✍ Scribed by C.C. Jain; S.S. Wang; K.W. Huang; T.H. Chuang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Intermetallic reactions in Sn-8Zn-20In s

✍ Yu-Chih Liu; Wei-Hong Lin; Hsiu-Jen Lin; Tung-Han Chuang 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 516 KB

Intermetallic reactions in a Sn-20In-2.8

✍ Hui-Min Wu; Feng-Chih Wu; Tung-Han Chuang 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 732 KB

Intermetallic compounds formed during th

✍ M. D. Cheng; S. Y. Chang; S. F. Yen; T. H. Chuang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 42 KB

Intermetallic compounds formed during th

✍ M. D. Cheng; S. Y. Chang; S. F. Yen; T. H. Chuang 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 810 KB

Intermetallic Reactions in Reflowed and

✍ C.C. Chi; L.C. Tsao; C.W. Tsao; T.H. Chuang 📂 Article 📅 2007 🏛 Springer US 🌐 English ⚖ 852 KB

Intermetallic reactions in reflowed and

✍ Hsiu-Jen Lin; Tung-Han Chuang 📂 Article 📅 2006 🏛 Springer US 🌐 English ⚖ 865 KB