✦ LIBER ✦

Intermetallic compounds formed during the interfacial reactions between liquid In-49Sn solder and Ni substrates

✍ Scribed by S. S. Wang; Y. H. Tseng; T. H. Chuang

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Intermetallic compounds formed during in

✍ M. Y. Chiu; S. S. Wang; T. H. Chuang 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 474 KB

Prediction of primary intermetallic comp

✍ Won Kyoung Choi; Hyuck Mo Lee 📂 Article 📅 2002 🏛 Elsevier Science 🌐 English ⚖ 68 KB

Phase identification and growth kinetics

✍ T. H. Chuang; C. L. Yu; S. Y. Chang; S. S. Wang 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 354 KB

Intermetallic compounds formed during th

✍ T. H. Chuang; S. Y. Chang; L. C. Tsao; W. P. Weng; H. M. Wu 📂 Article 📅 2003 🏛 Springer US 🌐 English ⚖ 649 KB

Interfacial reactions and growth kinetic

✍ Dae-Gon Kim; Seung-Boo Jung 📂 Article 📅 2005 🏛 Elsevier Science 🌐 English ⚖ 456 KB

Intermetallic compound layer growth at t

✍ Jeong-Won Yoon; Young-Ho Lee; Dae-Gon Kim; Han-Byul Kang; Su-Jeong Suh; Cheol-Wo 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 439 KB