Intermetallic Compound Growth and Reliability of Cu Pillar Bumps Under Current Stressing

✍ Scribed by Byoung-Joon Kim; Gi-Tae Lim; Jaedong Kim; Kiwook Lee; Young-Bae Park; Ho-Young Lee; Young-Chang Joo

• Publisher: Springer US
• Year: 2010
• Tongue: English
• Weight: 262 KB
• Volume: 39
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-010-1324-z