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Interficial stability of Cu/Cu(Ru)/Si contact system for barrier-free copper metallization

✍ Scribed by Ying Wang; Mi-lin Zhang; Fei Cao; Yun-tao Liu; Lei Shao


Book ID
116608335
Publisher
Elsevier Science
Year
2011
Tongue
English
Weight
557 KB
Volume
509
Category
Article
ISSN
0925-8388

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