Interfacial thermal contact resistance between aluminum nitride and copper at cryogenic temperature

✍ Scribed by Ling Shi, Gang Wu, Hui-ling Wang, Xin-ming Yu

• Book ID: 113023689
• Publisher: Springer-Verlag
• Year: 2011
• Tongue: English
• Weight: 415 KB
• Volume: 48
• Category: Article
• ISSN: 1432-1181
• DOI: 10.1007/s00231-011-0953-y