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Interfacial reactions in Ti/SiC layered films with and without thin diffusion barriers

โœ Scribed by M. Nathan; J.S. Ahearn


Publisher
Elsevier Science
Year
1990
Tongue
English
Weight
605 KB
Volume
126
Category
Article
ISSN
0921-5093

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โœฆ Synopsis


Four materials--Al203, TiB x, VB x, and TaBx (x < 2)--with thicknesses from 50 to 200 A were evaluated as interracial reaction barriers between titanium and SiC in a thin film model system. Two of these materials--Al203 and TiBx--show effectiveness in slowing the interdiffusion and reaction of titanium and SiC under normal vacuum annealing at 820 ยฐC. None of the four materials shows any significant effect on the reaction in rapid thermal annealings at 900 and IO00ยฐC, most probably owing due to thermal shock influences on the thin film system. The first product of the reaction between titanium and SiC is TisSi3, regardless of barrier.


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