Interfacial Reactions and Microstructures of Sn-0.7Cu-xZn Solders with Ni-P UBM During Thermal Aging

✍ Scribed by Moon Gi Cho; Sung K. Kang; Sun-Kyoung Seo; Da-Yuan Shih; Hyuck Mo Lee

• Publisher: Springer US
• Year: 2009
• Tongue: English
• Weight: 609 KB
• Volume: 38
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-009-0867-3