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Interfacial morphologies and possible mechanisms of copper wafer bonding

✍ Scribed by K. N. Chen; A. Fan; R. Reif

Book ID: 110349737
Publisher: Springer
Year: 2002
Tongue: English
Weight: 200 KB
Volume: 37
Category: Article
ISSN: 0022-2461
DOI: 10.1023/a:1016554821201

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