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Interfacial morphologies and possible mechanisms of a novel low temperature insertion bonding technology based on micro-nano cones array

✍ Scribed by Wenyan Geng; Zhuo Chen; Anmin Hu; Ming Li


Book ID
113795735
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
631 KB
Volume
78
Category
Article
ISSN
0167-577X

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