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Interface structure and formation mechanism of diffusion-bonded SiC/Ni-Cr joint

✍ Scribed by Feng Jicai; Liu Huijie; M. Naka; J. C. Schuster


Book ID
110240668
Publisher
Springer
Year
2001
Tongue
English
Weight
111 KB
Volume
20
Category
Article
ISSN
0261-8028

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