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Interface structure and adhesion of sputtered Ti layers on Si: the effect of heat treatment

✍ Scribed by I. Kondo; T. Yoneyama; K. Kondo; O. Takenaka; A. Kinbara


Book ID
107864314
Publisher
Elsevier Science
Year
1993
Tongue
English
Weight
342 KB
Volume
236
Category
Article
ISSN
0040-6090

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