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Interface reaction between copper and molten tin–lead solders

✍ Scribed by K.H Prakash; T Sritharan

Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
379 KB
Volume
49
Category
Article
ISSN
1359-6454

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Dissolution and reaction both play important roles in the interaction between Au studs and PbSn solders. The kinetics of interfacial reaction in this system has been studied by measuring the rate of Au consumption and growth rate of the AuSn intermetallic compound (IMC) layer at temperatures from 19