Interactions between Silver–Palladium Metallization and Tin–Lead–Silver Solder

✍ Scribed by Li, G. Y. ;Chan, Y. C.

• Publisher: John Wiley and Sons
• Year: 1998
• Tongue: English
• Weight: 102 KB
• Volume: 166
• Category: Article
• ISSN: 0031-8965
• DOI: 10.1002/(sici)1521-396x(199804)166:2<r13::aid-pssa999913>3.0.co;2-5