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Interdiffusion, stress, and microstructure evolution during annealing in Co/Cu/Co trilayers

✍ Scribed by Bruckner, W.; Baunack, S.; Thomas, J.; Hecker, M.; Schneider, C. M.

Book ID: 111872817
Publisher: American Institute of Physics
Year: 2002
Tongue: English
Weight: 633 KB
Volume: 91
Category: Article
ISSN: 0021-8979
DOI: 10.1063/1.1479750

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