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Interaction between helium bubbles and migrating grain boundaries in copper

✍ Scribed by S.R Pati; P.S Maiya

Publisher: Elsevier Science
Year: 1971
Weight: 776 KB
Volume: 19
Category: Article
ISSN: 0001-6160
DOI: 10.1016/0001-6160(71)90137-4

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