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Integration of a high density Ta2O5 MIM capacitor following 3D damascene architecture compatible with copper interconnects

✍ Scribed by M. Thomas; A. Farcy; N. Gaillard; C. Perrot; M. Gros-Jean; I. Matko; M. Cordeau; W. Saikaly; M. Proust; P. Caubet; E. Deloffre; S. Crémer; S. Bruyère; B. Chenevier; J. Torres

Book ID: 104051560
Publisher: Elsevier Science
Year: 2006
Tongue: English
Weight: 642 KB
Volume: 83
Category: Article
ISSN: 0167-9317
DOI: 10.1016/j.mee.2006.09.027

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[IEEE 2007 IEEE Symposium on VLSI Technology - Kyoto, Japan (2007.06.12-2007.06.14)] 2007 IEEE Symposium on VLSI Technology - Reliable 3D Damascene MIM architecture embedded into Cu interconnect for a Ta2O5 capacitor record density of 17 fF/¿m2

✍ Thomas, M.; Farcy, A.; Perrot, C.; Deloffre, E.; Gros-Jean, M.; Benoit, D.; Rich 📂 Article 📅 2007 🏛 IEEE 🌐 Japanese ⚖ 836 KB