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Integrated deposition process for copper metallization

Book ID
122867057
Publisher
Elsevier Science
Year
2001
Tongue
English
Weight
101 KB
Volume
99
Category
Article
ISSN
0026-0576

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In this paper we present the technology of electroless Cu deposition for ultra-large-scale integration. The technology has several components: the solution chemistry, the operation conditions, the seeding, the equipment and the process integration. Sodium-free solution was used and optimized to achi