Although previous works have shown the marked influence of thiourea as an organic additive in electrolyte bulk on copper electrodeposition, a variety of mechanisms could be responsible. The present paper concerns the effect of a thiourea layer adsorbed prior to copper electrodeposition. First eviden
β¦ LIBER β¦
Influence of thiourea on the nucleation of copper on polycrystalline platinum
β Scribed by A. Tarallo; L. Heerman
- Book ID
- 111529477
- Publisher
- Springer
- Year
- 1999
- Tongue
- English
- Weight
- 134 KB
- Volume
- 29
- Category
- Article
- ISSN
- 0021-891X
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