𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Influence of thiourea on the nucleation of copper on polycrystalline platinum

✍ Scribed by A. Tarallo; L. Heerman


Book ID
111529477
Publisher
Springer
Year
1999
Tongue
English
Weight
134 KB
Volume
29
Category
Article
ISSN
0021-891X

No coin nor oath required. For personal study only.


πŸ“œ SIMILAR VOLUMES


Adsorption of thiourea on polycrystallin
✍ Magali Quinet; Fabrice Lallemand; Laurence Ricq; Jean-Yves Hihn; Patrick Delobel πŸ“‚ Article πŸ“… 2010 πŸ› Elsevier Science 🌐 English βš– 763 KB

Although previous works have shown the marked influence of thiourea as an organic additive in electrolyte bulk on copper electrodeposition, a variety of mechanisms could be responsible. The present paper concerns the effect of a thiourea layer adsorbed prior to copper electrodeposition. First eviden

Formation and properties of UPD copper d
✍ M. WΓΌnsche; H. Meyer; R. Schumacher πŸ“‚ Article πŸ“… 1995 πŸ› Elsevier Science 🌐 English βš– 724 KB

Formation and properties of UPD Cu deposits on polycrystalline Pt electrodes have been studied in sulfuric acid with various additions of chloride, thiourea (TU), acetonitrile (ACN) and polyethylenglycole (PEG). The experimental set-up combines coulometry, in situ microgravimetry and in situ differe