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Influence of the Texture of Woven Materials on Their Etching Rate in Oxygen Plasma

✍ Scribed by E. V. Kuvaldina; V. V. Rybkin; V. A. Titov; A. N. Ivanov

Book ID
111566336
Publisher
SP MAIK Nauka/Interperiodica
Year
2000
Tongue
English
Weight
58 KB
Volume
34
Category
Article
ISSN
0018-1439

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✍ R. Knizikevičius πŸ“‚ Article πŸ“… 2009 πŸ› Elsevier Science 🌐 English βš– 184 KB

The reactive ion etching (RIE) of SiO 2 in CF 4 + H 2 plasma is considered. The influence of activated polymer on the RIE rate of SiO 2 in CF 4 + H 2 plasma is determined by extrapolation of experimentally measured kinetics of the etching rate. It is found that the increased surface coverage by CF 2