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Influence of the deposition temperature on the properties of copper thin films prepared by alternating injection of Cu(ethylketoiminate)2 and H2 on a ruthenium substrate

✍ Scribed by Kwang-Min Park; Jae-Kyung Kim; Byeol Han; Won-Jun Lee; Jinsik Kim; Hyun-Koock Shin

No coin nor oath required. For personal study only.

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