✦ LIBER ✦

Influence of tantalum and silver interlayers on thermal stress evolution in copper thin films on silicon substrates

✍ Scribed by T.K. Schmidt; T.J. Balk; G. Dehm; E. Arzt

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Thermal effects during the deposition of

✍ R. Abermann; H.P. Martinz; R. Kramer 📂 Article 📅 1980 🏛 Elsevier Science 🌐 English ⚖ 597 KB

Effect of thermal cycling on stresses in

✍ C. W. Lim; C. C. Toh; J. K. Fu; K. Lahiri 📂 Article 📅 1996 🏛 Springer 🌐 English ⚖ 314 KB

On the influence of thermal effects on i

✍ R. Koch; R. Abermann 📂 Article 📅 1985 🏛 Elsevier Science 🌐 English ⚖ 490 KB

Influence of the substrate thermal expan

✍ Daniel, M.; Friedemann, M.; Jöhrmann, N.; Liebig, A.; Donges, J.; Hietschold, M. 📂 Article 📅 2012 🏛 John Wiley and Sons 🌐 English ⚖ 961 KB

Influence of the structural rearrangemen

✍ P.G. Vassilev 📂 Article 📅 1975 🏛 Elsevier Science 🌐 English ⚖ 167 KB

Transport profiles, the influence of int

✍ Jong-Hyun Lee; Sorin Cristoloveanu; Alain Chovet 📂 Article 📅 1982 🏛 Elsevier Science 🌐 English ⚖ 268 KB