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Influence of post-curing and temperature effects on bulk density, glass transition and stress-strain behaviour of imidazole-cured epoxy network

✍ Scribed by Ching-Shiun Wu

Publisher: Springer
Year: 1992
Tongue: English
Weight: 506 KB
Volume: 27
Category: Article
ISSN: 0022-2461
DOI: 10.1007/bf01154105

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