Influence of plastic deformation on the ideal electrical and thermal resistances of copper and aluminium

✍ Scribed by W. Holzhäuser

• Publisher: Elsevier Science
• Year: 1967
• Tongue: English
• Weight: 232 KB
• Volume: 7
• Category: Article
• ISSN: 0011-2275
• DOI: 10.1016/s0011-2275(67)80008-0

✦ Synopsis

Electrical and thermal conductivity measurements for several metals have been carried out in the temperature range between 17 and 50 ° K and are reported in this paper. Changing the physical state of the specimens was found to influence the residual resistance and cause characteristic variations of the ideal resistance

Influence of plastic deformation on the ideal electrical and thermal resistances of copper and aluminium

W. HOLZHAUSERt

B Y stepwise extension at 20 ° K (up to Al/Io ~_ 30 per cent), and subsequent recovery in the range 80 ° K to room temperature, the concentration of physical lattice defects in copper and aluminium specimens previously annealed in vacuum was varied several times. After each change of physical state, the electrical and thermal resistivities of specimens were measured between about 17 and 50 ° K. Scattering of the measured values was about + 1 per cent. Measurements were carried out in a cryostat described previously) -3