Influence of pin chuck ring seals and polishing steps on wafer flatness

✍ Scribed by Atsunobu Une; Kenichiro Yoshitomi; Masaaki Mochida; Nagahisa Ogasawara

• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 576 KB
• Volume: 87
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2009.10.020