Influence of pH of phenol-formaldehyde resin and thermal treatment on the properties of hardboard
β Scribed by N. A. Fadl; M. Rakha
- Book ID
- 110603920
- Publisher
- Springer-Verlag
- Year
- 1984
- Tongue
- English
- Weight
- 451 KB
- Volume
- 42
- Category
- Article
- ISSN
- 0018-3768
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The curing reaction of bisphenol-A epoxy resin (BPAER) with boron-containing phenol-formaldehyde resin (BPFR) was studied by isothermal and dynamic differential scanning calorimetry (DSC). The kinetic reaction mechanism in the isothermal reaction of BPAER-BPFR was shown to follow autocatalytic kinet
The curing behavior of commercial phenol-formaldehyde novolac resins with hexamethylenetetramine (HMTA) under non-isothermal and isothermal conditions was followed by dynamic rheological measurements. Changes in parameters of the viscoelastic material such as storage modulus (Gβ²) and complex viscosi