✦ LIBER ✦

Influence of Ni concentration and Ni3Sn4nanoparticles on morphology of Sn-Ag-Ni solders by mechanical alloying

✍ Scribed by Hsiang-Yi Lee; Jenq-Gong Duh

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Investigations of wetting properties of

✍ Chun-Chong Fu; Chih-chi Chen 📂 Article 📅 2011 🏛 Elsevier 🌐 English ⚖ 175 KB

Effect of Cu concentration on morphology

✍ Szu-Tsung Kao; Jenq-Gong Duh 📂 Article 📅 2004 🏛 Springer US 🌐 English ⚖ 894 KB

Growth kinetics of Ni3Sn4 and Ni3P layer

✍ Jeong-Won Yoon; Seung-Boo Jung 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 430 KB

Effect of Cu concentration on the reacti

✍ C. E. Ho; R. Y. Tsai; Y. L. Lin; C. R. Kao 📂 Article 📅 2002 🏛 Springer US 🌐 English ⚖ 625 KB

Interfacial reactions and compound forma

✍ Szu-Tsung Kao; Jenq-Gong Duh 📂 Article 📅 2005 🏛 Springer US 🌐 English ⚖ 684 KB

Effect of Electromigration on the Mechan

✍ Aditya Kumar; Ying Yang; Chee C. Wong; Vaidhyanathan Kripesh; Zhong Chen 📂 Article 📅 2008 🏛 Springer US 🌐 English ⚖ 881 KB