Influence of minute amount of elements Bi, Ag and In on surface tension and soldering process performance of tin–lead based solders

✍ Scribed by X. P. Zhang; H. W. Wang; Y. W. Shi

• Book ID: 111591068
• Publisher: Springer US
• Year: 2004
• Tongue: English
• Weight: 352 KB
• Volume: 15
• Category: Article
• ISSN: 0957-4522
• DOI: 10.1023/b:jmse.0000032585.03009.1b