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Influence of interface materials on the thermal impedance of electronic packages

✍ Scribed by G. De Mey; J. Pilarski; M. Wójcik; M. Lasota; J. Banaszczyk; B. Vermeersch; A. Napieralski

Book ID
108140081
Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
299 KB
Volume
36
Category
Article
ISSN
0735-1933

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