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Influence of Thermal Cycling on the Thermal Resistance of Solder Interfaces

โœ Scribed by H.Y. Guo; J.D. Guo; J.K. Shang

Book ID
107455567
Publisher
Springer US
Year
2009
Tongue
English
Weight
922 KB
Volume
38
Category
Article
ISSN
0361-5235

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An ~tended period ofthe~al ~e ~tw~n me ~ ~pemtore Imt) and 8O0"C + mwied om on the ZIO~ smbil+~d by 3.S. 5.3 ,,d 6.+ moZ% Y+Os The v,riat ~t i of the e[~ml ~,a,m+v~t y ,rid the pha~ ~ p<~+t+on of ~+ Y~ d ud~ the~l ~cle ~,~ stud~ea. The tnd~dd~l ~mfibm~o, of the ~lk and ~= ~n bouna~ m ~ eo~ao~ti.~ty