Influence of gold thin-film interlayers on anodic bonding of copper microstructures produced by LIGA

✍ Scribed by A. Gerlach; D. Maas; D. Seidel

• Book ID: 106186352
• Publisher: Springer-Verlag
• Year: 1998
• Tongue: English
• Weight: 195 KB
• Volume: 5
• Category: Article
• ISSN: 0946-7076
• DOI: 10.1007/s005420050149