in-situ electromigration study on Sn−Ag−Cu solder joint by digital image speckle analysis

✍ Scribed by Luhua Xu; John H. L. Pang

• Book ID: 107453813
• Publisher: Springer US
• Year: 2006
• Tongue: English
• Weight: 320 KB
• Volume: 35
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-006-0305-8