✦ LIBER ✦
Investigation of Stress Evolution Induced by Electromigration in Sn-Ag-Cu Solder Joints Based on an X-Ray Diffraction Technique
✍ Scribed by Limin Ma; Fu Guo; Guangchen Xu; Xitao Wang; Hongwen He; Haiyan Zhao
- Publisher
- Springer US
- Year
- 2011
- Tongue
- English
- Weight
- 352 KB
- Volume
- 41
- Category
- Article
- ISSN
- 0361-5235
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