𝔖 Bobbio Scriptorium

✦ LIBER ✦

Improving manufacturing reliability in IC package assembly using the FMEA technique : Shankara Prasad. IEEE Trans. Compon. Hybrids mfg Technol. 14(3), 452 (1991)

Book ID: 103281867
Publisher: Elsevier Science
Year: 1992
Tongue: English
Weight: 112 KB
Volume: 32
Category: Article
ISSN: 0026-2714
DOI: 10.1016/0026-2714(92)90727-3

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

A generic computer simulation model to c

A generic computer simulation model to characterize photolithography manufacturing area in an IC FAB facility : Kowdle Prasad. IEEE Trans. Compon. Hybrids mfg Technol. 14(3), 483 (1991)

📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 117 KB

CEPT—a computer-aided manufacturing appl

CEPT—a computer-aided manufacturing application for managing equipment reliability and availability in the semiconductor industry : Prasad Rampalli, Arakere Ramesh and Nimish Shah. IEEE Trans. Compon. Hybrids mfg Technol. 14(3), 499 (September 1991)

📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 83 KB

A comprehensive approach for the analysi

A comprehensive approach for the analysis of package induced stress in ICs using analytical and empirical methods : Rajendra D. Pendse. IEEE Trans. Compon. Hybrids mfg Technol. 14(4), 870 (December 1991)

📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 112 KB

Improvements in wire bonding and soldera

Improvements in wire bonding and solderability of surface mount components using plasma cleaning techniques : Ray D. Rust, Daryl Ann Doane and Irene Sawchyn. IEEE Trans. Compon. Hybrids mfg Technol. 14(3), 573 (1991)

📂 Article 📅 1992 🏛 Elsevier Science 🌐 English ⚖ 225 KB