✦ LIBER ✦
A comprehensive approach for the analysis of package induced stress in ICs using analytical and empirical methods : Rajendra D. Pendse. IEEE Trans. Compon. Hybrids mfg Technol. 14(4), 870 (December 1991)
- Publisher
- Elsevier Science
- Year
- 1992
- Tongue
- English
- Weight
- 112 KB
- Volume
- 32
- Category
- Article
- ISSN
- 0026-2714
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