✦ LIBER ✦

Improved thermal management for GaN power electronics: Silver diamond composite packages

✍ Scribed by M. Faqir; T. Batten; T. Mrotzek; S. Knippscheer; M. Massiot; M. Buchta; H. Blanck; S. Rochette; O. Vendier; M. Kuball

Book ID: 119326726
Publisher: Elsevier Science
Year: 2012
Tongue: English
Weight: 379 KB
Volume: 52
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2012.06.119

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Direct Low-Temperature Integration of Na

Direct Low-Temperature Integration of Nanocrystalline Diamond with GaN Substrates for Improved Thermal Management of High-Power Electronics

✍ Vivek Goyal; Anirudha V. Sumant; Desalegne Teweldebrhan; Alexander A. Balandin 📂 Article 📅 2012 🏛 John Wiley and Sons 🌐 English ⚖ 542 KB

Applications of advanced composites for

Applications of advanced composites for satellite packaging for improved electronic component thermal management

✍ John Glatz; D.L. Vrable 📂 Article 📅 1993 🏛 Elsevier Science 🌐 English ⚖ 704 KB

Comprehensive Composite Materials || Com

Comprehensive Composite Materials || Composites for Electronic Packaging and Thermal Management

✍ Chung, D.D.L. 📂 Article 📅 2000 🏛 Elsevier 🌐 English ⚖ 342 KB

Advances in composite materials for ther

Advances in composite materials for thermal management in electronic packaging

✍ Carl Zweben 📂 Article 📅 1998 🏛 The Minerals, Metals & Materials Society 🌐 English ⚖ 287 KB

[Springer Series in Advanced Microelectr

[Springer Series in Advanced Microelectronics] Advanced Materials for Thermal Management of Electronic Packaging Volume 30 || Thermally Conductive Ceramic Matrix Composites

✍ Tong, Xingcun Colin 📂 Article 📅 2010 🏛 Springer New York 🌐 English ⚖ 692 KB

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, mo

[IEEE Fifteenth Annual IEEE Semiconducto

[IEEE Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium. SEMI-THERM. 1999 - San Diego, CA, USA (9-11 March 1999)] Fifteenth Annual IEEE Semiconductor Thermal Measurement and Management Symposium (Cat. No.99CH36306) - Thermal modeling of diamond-based power electronics packaging

✍ Fabis, P.M.; Shum, D.; Windischmann, H. 📂 Article 📅 1999 🏛 IEEE 🌐 English ⚖ 541 KB