In modelling transmission electron microscopy (TEM) images with the dynamical theory of electron diffraction, the sample thickness at the region of interest must be accurately known. A technique of sample preparation for cross-sectional single-crystal samples has been developed to provide this infor
Improved TEM samples of semiconductors prepared by a small-angle cleavage technique
โ Scribed by John P. McCaffrey
- Publisher
- John Wiley and Sons
- Year
- 1993
- Tongue
- English
- Weight
- 535 KB
- Volume
- 24
- Category
- Article
- ISSN
- 1059-910X
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โฆ Synopsis
A small-angle cleavage technique has been developed that produces superior transmission electron microscope (TEM) samples of semiconductors and related materials. The technique involves back-thinning the sample to approximately 100 km, then scribing a groove on this back face at a specified small angle to a standard cleavage plane. The sample is cleaved along this scribe line followed by cleaving along the standard cleavage plane to produce a thin wedged sample. Samples prepared by this method are characterized and compared with conventional and low-angle ion milled samylles. The technique is illustrated, and the characteristic geometry of the cleaved sample is explained in terms of a simplified cleavage model.
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