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Application of the small-angle cleavage technique to thickness measurement of TEM samples

✍ Scribed by McCaffrey, J.P.

Publisher: John Wiley and Sons
Year: 1997
Tongue: English
Weight: 201 KB
Volume: 36
Category: Article
ISSN: 1059-910X
DOI: 10.1002/(sici)1097-0029(19970301)36:5<372::aid-jemt5>3.0.co;2-n

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✦ Synopsis

In modelling transmission electron microscopy (TEM) images with the dynamical theory of electron diffraction, the sample thickness at the region of interest must be accurately known. A technique of sample preparation for cross-sectional single-crystal samples has been developed to provide this information. This technique, based on the small-angle cleavage technique, can allow a direct measurement of the sample thickness at the region where cross-sectional TEM analysis has been undertaken. Several cross-sectional samples of GaAs-based multiple quantum wells were prepared with parallel cleaved faces and thicknesses in the range of 50 to 200 nm. The samples were initially mounted so that cross-sectional images were obtained, then on suitable samples the mount was adjusted to obtain a plan view image of the same area. With suitable care, this technique provided an accurate thickness measurement of a cross-sectional region of a sample, which allowed subsequent modelling and analysis.

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