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Improved electromigration reliability of surface acoustic wave devices using Ti/Al-Mo/Ti/Al-Mo electrodes

✍ Scribed by Dongmei Li; Ming Liu

Book ID: 107668945
Publisher: Nonferrous Metals Society of China
Year: 2009
Tongue: English
Weight: 611 KB
Volume: 28
Category: Article
ISSN: 1001-0521
DOI: 10.1007/s12598-009-0107-2

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